Recently, Shenju's new-generation wireless AI audio platform WS310 has officially entered mass production. Equipped with the FUXI software development platform, it can be widely applied to new-generation smart wireless audio devices such as smart wireless microphones and TWS/OWS earphones.The platform boasts remarkable core advantages:In terms of communication, it has a maximum RF transmission power of 14dBm. Combined with self-developed low-latency 2.4G communication technology, Bluetooth 5.4 dual-mode connection, and an adaptive power strategy, it maintains high reliability and low power consumption even in complex RF environments.In audio processing, its newly designed Codec solution enhances ADC&DAC performance. With a built-in high-energy-efficiency NPU that can run Transformer models, it realizes functions like AI noise reduction, optimizing sound pickup quality.For wireless microphone applications, the solution supports multiple transmission mechanisms including 2T1R, 2T2R, and 4T1R. It integrates a 24-bit codec to achieve full-link 48K 24bit transmission, and also supports intelligent anti-pop and 32-bit floating-point recording.The chip adopts a compact 4x4mm QFN32 package, helping terminal devices achieve long battery life and excellent acoustic performance in a compact structure. Shenju will work with ecological partners to promote the application of WS310 in scenarios such as educational live streaming and stage performances, providing users with high-quality sound experiences.
绅聚科技于2021年底正式推出的云P3芯片,其作为全球首款将云技术和传统MP3方案结合、改造与升级的全新双核AI芯片,已经成功进入量产阶段。截止目前,批量出货已超百万颗 。