Recently, Shenju's new-generation wireless AI audio platform WS310 has officially entered mass production. Equipped with the FUXI software development platform, it can be widely applied to new-generation smart wireless audio devices such as smart wireless microphones and TWS/OWS earphones.The platform boasts remarkable core advantages:In terms of communication, it has a maximum RF transmission power of 14dBm. Combined with self-developed low-latency 2.4G communication technology, Bluetooth 5.4 dual-mode connection, and an adaptive power strategy, it maintains high reliability and low power consumption even in complex RF environments.In audio processing, its newly designed Codec solution enhances ADC&DAC performance. With a built-in high-energy-efficiency NPU that can run Transformer models, it realizes functions like AI noise reduction, optimizing sound pickup quality.For wireless microphone applications, the solution supports multiple transmission mechanisms including 2T1R, 2T2R, and 4T1R. It integrates a 24-bit codec to achieve full-link 48K 24bit transmission, and also supports intelligent anti-pop and 32-bit floating-point recording.The chip adopts a compact 4x4mm QFN32 package, helping terminal devices achieve long battery life and excellent acoustic performance in a compact structure. Shenju will work with ecological partners to promote the application of WS310 in scenarios such as educational live streaming and stage performances, providing users with high-quality sound experiences.
On August 26, 2025, Shenju Technology (Zhuhai) held a grand headquarters relocation ceremony at Gechuang·No.1 in Zhuhai High-Tech Zone. All employees of the company, along with leaders of the High-Tech Zone, shareholders, customers and supply chain partners, gathered to witness this milestone event.Mr. Zhao Liang from Zhuhai Technology Group delivered a speech, affirming Shenju Technology’s contributions in the fields of chips and edge-side AI, as well as its role in driving the regional industrial chain and digital economy. Mr. Li Zhi, Chairman of Shenju Technology, stated that the relocation is a "bugle call for departure" for the company’s high-quality development. He clarified the company’s strategy of focusing on smart wearable chips and edge intelligence, emphasized adhering to its original technological aspiration, and announced plans to fully embrace AI in three aspects: products, market and R&D. Meanwhile, he made commitments to customers, partners, colleagues and shareholders.The highlight of the ceremony saw guests and company executives jointly cutting the ribbon and unveiling the new headquarters logo, bringing the event to a successful conclusion. This relocation marks the upgrade of Shenju Technology’s office environment and industrial layout, demonstrating its determination to deepen engagement in the semiconductor and edge AI sectors and advance its AI strategy. In the future, the company will contribute to the development of China’s semiconductor industry.
绅聚科技于2021年底正式推出的云P3芯片,其作为全球首款将云技术和传统MP3方案结合、改造与升级的全新双核AI芯片,已经成功进入量产阶段。截止目前,批量出货已超百万颗 。