TWS300
Intelligent Bluetooth Audio SoC for TWS & OWS
Product Overview
TWS300 is an intelligent Bluetooth 5.4 SOC designed for TWS and OWS applications. The chip integrates a high-performance 32-bit RISC processor, BT&BLE dual-mode 5.4 module, Feed-Forward ANC, 24-bit high-performance audio CODEC, high-performance power management module, serial flash, and flexible common peripheral interfaces. Shenju Technology provides customers with complete TWS & OWS solutions, including SOC chips, intelligent audio algorithms, software, hardware, cloud services, and production testing.
Applications
Main applications: OWS and spatial audio TWS products.
Key features：
- Supports OWS dynamic bass enhancement.
- Supports dynamic head - tracking spatial audio.
- Supports feed-forward ANC.
- Supports intelligent dual-MIC ENC.
- Supports low-latency gaming mode.
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